conduction cooled vpx. This platform supports up to eight 0. conduction cooled vpx

 
 This platform supports up to eight 0conduction cooled vpx  It delivers cooling performance comparable to conduction-cooled systems, yet is easier to implement and weighs much less than a comparable

It is designed for use in deployed industrial and military applications in harsh environments. VPX Backplane, 3 U, 5 Slots, Full-Mesh, Without RTM. 2 coaxial/RF for four of the slots (defaultbackplane routing) All I/O are thru the front of the chassis; 250W integrated. The SX-150 is available in the VITA 48. The 3U VPX backplane uses standard 1. This product is compatible with the USRP Hardware Driver (UHD) maintained by NI in a VPX SDR. 62H. 8-2017, “Mechanical Standard for Electronic VPX Plug-in Modules Using Air Flow Through Cooling,” is a bit long-winded, but it’s essentially an air-cooled standard. 2 conduction cooled 6U VPX module with 1 inch pitch : • 6Ux160mm form factor as defined by IEEE 1101. 3 V. 3 V. Physical Characteristics. View. Axis Tool Suite, Health Toolkit, Hardware. It also supports dual Gigabit Ethernet, GPIO, I²C, XMC I/O, PMC I/O. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by convection cooling and to an attached cold plate by conduction cooling. nVent SCHROFF offers you a wide range of Card Lok, Conduction Cooling and VPX Chassis. Rugged Conduction Cooled Assemblies and Modules. Power Supplies are available in 3U and 6U, in air- and conduction- cooled form factors >for cPCI, VPX, VME64x & custom applications. Hartmann’s VPX Power Supplies are built for the most rugged applications with quality and reliability in mind. Heat generated inside the chassis by the electronics flows into the chassis aluminum sidewalls and down into the cold plate. 8 in. 0 specification. Part of our LoC3U-500 Series of liquid cooled enclosures, the LoC3U-510 is an ATR chassis designed to maintain safe operating temperatures for high power 3U VPX conduction cooled systems. XIt1083. The result is a powerful and flexible I/O processor module that is capable of executing custom instruction sets and algorithms. Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O. 6U VPX air cooled as per VITA 62, front Panel with Extractor handle, 160 mm deep. It supports up to two 0. Usually the test adapter includes fields for voltage and amp, current measurements and in some cases also some pins for wire wrap to conduct custom. ½ ATR-compliant, natural convection-cooled or conduction-cooled chassis (reduced height and length) Dimensions: 10. 3U Conduction cooled models available in 1″ form factor. Input Voltages: 85-264 VAC, 5. 5” x 7. It defines a keying system that can be added to VME64x boards and backplanes in a conduction cooled environment (IEEE 1101. The new single board computer is also differentiated by its advanced cooling architecture for conduction cooled boards. Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. Product Features. Development chassis and accessories for VPX and SOSA aligned module payloads to support every stage of product development. 88 in. Learn more about this product below »Acromag’s XMC-7A200CC modules feature a high-performance user-configurable Xilinx® Artix®-7 FPGA enhanced with high-speed memory and a high-throughput serial bus interface. This allows testing of the conduction cooled modules without going through the thermal chamber. It features a FMC+ slot. A ternary biochar/vanadium pentoxide/graphite like carbon nitride (BC/V2O5/g-C3N4 denoted BC/VO/CN) composite was prepared by a simple hydrothermal method and its. View. . pitch slots and built in accordance. High performance 3U or 6U single board computers feature air or conduction-cooled options. 8 in. View product Compare. 8 in. Designed for COTS applications this Intel SBC utilizes the Intel C230 series PCH chipset for extensive I/O support. Load sharing circuitry for up to 4 modules. 1. With Calmark Card Loks and Birtcher Wedge Loks. The Intel® Atom™ E3800 processors provide excellent computational performance and I/O functionality for their power profile and size. Utilizing our extensive experience in embedded. For use in DC systems, they are 3 U high by 5 HP (1-inch) wide modules with guide blocks, for use in conduction cooled VPX systems. A brief low intensity electric current is applied to individual nerves, with recording. 7W. Block Diagram. Abaco Announces Production of. Conduction cooled version: -40°C to +75°C at wedge locks (+85°C optional) Air cooled version: -40°C to +75°C Storage Temp. Mechanical: 3U VPX conduction cooled as per VITA 62, with wedge locks and extractor handles, 160 mm deep. Clear all Compare. conduction-cooled heatframes are mechanical assemblies which perfectly match the component topography & requirements of a pcb intended for an embedded computing. Form Factor: 3U VPX Ethernet: 4 10/100/1000BASE-T USB: 2 USB 2. AoC3U-610 Conduction Cooling with Air Assist. FEATURES. 2-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. AFT relies on a heat frame that clamshells onto the entire board’s electronics. 84 W Weight Conduction cooled: 535. 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules. Part of our AoC3U-400 Series of rugged packaging solutions, the AoC3U-400 is an ATR chassis designed to maintain safe operating temperatures for high power 3U VPX and SOSA aligned conduction cooled systems. PCI-SYSTEMS Inc. 2 conduction cooled modules and VITA 67. 8, air flow-through cooling without sealing for small form factor 3U and 6U VPX modules, (ANSI. Form Factor: Custom Chassis Type: Custom. Compare. The VX305C-40G is also available with a VITA 48. Each DCM has 3Commercial Air-Cooled. 3 V @ 9 mA to 60 mA) Conduction Cooled: MMCX Jack (+3. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by convection cooling or to an attached cold plate by conduction. The development systems use Concurrent Technologies' commercial off the shelf boards which are also available as rugged conduction cooled, VPX-REDI boards ensuring that applications which are produced on the development Systems can be easily progressed to a ruggedized implementation. Hartmann Electronic VPX Standard Chassis are designed to allow any COTS or customer spec configuration in either 3U or 6U form factor taking into account a wide range of. The XPand1015 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. 3U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. In 2016, VITA announced the formation of a working group that will develop a new AFT cooling standard-VITA 48. Block Diagram. The chassis can accept a front and a rear module. Rugged Design Kit for development of 3U conduction-cooled VPX single board<br /> computers. See specifications for target performance. Part of our line of conduction cooled enclosures with air assist, the AoC3U-1400 is designed to maintain safe operating temperatures for high slot. Zynq Ultrascale+. "The conduction cooled 3U VPX CUBE is extremely rugged and reliable for military and aerospace applications where system size, weight, and power are critical, and high performance capability is demanded," says Barry Burnsides, Dawn VME Products Founder and CEO. Our selection of Intel, NXP Power. OpenVPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments. Conduction-cooled, rugged 3U VPX form factor. VPX Extender 3U All Differential - Conduction / Conduction. 2. 2 conduction cooled configuration and ready for rugged applications. The XChange3031 is a conduction-cooled 3U VPX Ethernet switch module. VP32004 - LinkedHope Intelligent Technologies Co. VPX hold up power supply is a type of power supply used in high-performance computing applications. Rugged Conduction Cooled Assemblies and Modules Conduction Cooled Assemblies and Modules Conduction Cooled Keys Systems and Components. The XPand1508 supports two standard VITA 46. Conduction cooled or air cooled; Conformal coating; RoHS or leaded soldering; SWaP (Size, Weight, and Power) Long-term product availability and support;. I designed this 3U VPX 0. Conduction cooled card guide for Dawn DC- (n) Series air cooled development chassis. 0 specification. M4067 is a military grade 6U VPX, 115VAC 3 phase, AC-DC PSU card that provides six outputs per VITA 62 and is rated at 700W output power. 2 conduction cooled modules because of their established deployment track record. VPX and SOSA aligned slots may support VITA 66 and. The internal SATA SSD memory modules combine the convenience of high-capacity off-the-shelf storage with the reliability of solid-state non-volatile memory. close. It defines a keying system that can be added to VME64x boards and backplanes in a conduction cooled environment (IEEE 1101. 3U VPX Conduction Cooled Carrier with PCIe Interface and Removable NVMe SSD Module RRT-3UVPX-NVMe-R-C NVMe SSD Connector Removable SSD Slot Module P0 PCIe x4 EP00-EP03 or P1 EP04-EP07 P2 SOSA Aligned Slot Profile: SLT3-PAY-1F1U1S1S1U1U2F1H-14. 25g Air cooled: 491. VITA 62 3U 400W AC/DC VPX power supply; Universal AC Input: Single Phase, 85-264VAC, 47-400Hz;Air-cooled, conduction-cooled, REDI versions; 3U single PMC/XMC slot; PCIe x8 Gen 2 interface; These 3U mezzanine carrier cards provide a simple and cost-effective solution for interfacing a PMC or XMC module to a VPX computer system. 8 are already available, such as this 3U VPX COTS system with air-flow-through cooling. 5, and Vulkan 1. Form Factor. Eight 6U VITA 48. 2 conduction cooled modules because of their established deployment track record. Related products. Specification Ordering Information Related Products Resources Summary The ADC-VPX3-XMC is a single XMC carrier for VPX based systems. 2 extraction levers and performance wedge locks • 3X - Samtec HQDP connectors for 1G. 15g. WIENER VPX power supplies are commercial off-the-shelf (COTS), air or conduction cooled single stage converters according to the ANSI/VITA 62. In some ways, AFT is a hybrid between air and conduction cooling, but with greater cooling capability. Power Supplies. 0 in. It provides one XMC/PMC site, alternately used as a PCIbus 32-bit/66 MHz or as an XMC site with either a x4 or a. • Rugged VPX systems where thermal performance is a concern • Options for second level maintenance APPLICATIONS • Meets VITA 48. Frame has injector/ejector latches for plug-in card. With a total of six high-performance Gigabit Ethernet interfaces (2 routed, 4 switched), the 3U conduction-cooled (VITA 48. VStream-VPX Datasheet Order Enquiry for VStream-VPX. 3U VPX Board - 1 x8, 2 x4, 4 x2 PCIe. It can operate up to 85 °C card edge temperature according to VITA 47 Product Features. Motorola – Single board chassis design with natural convection requirement. Features include: conduction cooling, 1" pitch, nternal EMI filters, I2C. Up to four power supplies can be paralleled to increase. XMC Adapter for 3U OpenVPX This electronics assembly can be damaged by ESD. or electronic warfare capabilities, which means that AFT-cooled plug-in VPX modules – including both 3U and 6U form factors – retains the current VITA 46. Alignment keying headers provided for extender and plug-in card. Learn more about this product below »XMC Module | Conduction- or Air-Cooled. 11 12 V 3. This platform supports up to eight 0. ½ ATR-compliant, natural convection-cooled or conduction-cooled chassis (reduced height and length) Dimensions: 10. This large scale, naval system had a complete HiK™ back-plane and utilize natural convection cooling. Study, diagrams and routing of the VPX and cPCI dual bus integrating high-speed links between. The VPX-REDI specifications of VITA 48. Accommodating cooling methods that include forced air, conduction, and liquid. This dual-port Ethernet XMC card is designed and tested to VITA 47 environmental standards for air-cooled or VITA 20. 08 of Vita65. Conduction-Cooled XMC with Dual 10 Gigabit Ethernet Interfaces and Rugged Optical Connector. ANSI/VITA 0- 001[R 005] defines the rules for designing Our VPX backplanes are designed to allow any COTS or customer spec by providing a wide range of available VPX and OpenVPX profiles. Configure your PCB Wedge Lok. The AcroExpress ® VPX6600 is a high-performance 3U OpenVPX TM embedded single board computer based on the 6th Generation Skylake Intel ® Xeon ® E processor and PCH. The Ruggedized Enhanced Design Implementation (VPX-REDI) lays out the mechanical design requirements for forced-air cooling, conduction cooling, and liquid cooling in VPX modules, providing detailed. The XPand1303 is a low-cost, flexible, development platform. MIL-STD 461. The open frame design includes a backplane, power supply, fan cooling, and rear transition slots in support of a variety of test functions. 8 Live NTSC/PAL/RS-170 video inputs; 4 x Audio input; 8 x D1 size capture at full frame rate; Conduction cooled 3U VPX module; Overlay frame grabber PAL RS-170 NTSC video capture OpenVPX VPX. SX-153 Dual-Enclave 100/40 Gigabit Ethernet Switch. (W) x 5. XPand6902. Fax: (604) 875-5867. Development chassis for VPX and SOSA aligned module payloads. While air and conduction cooling are often implemented to address cooling challenges, liquid cooling solutions can be effective for designs at the chassis, board, and chip levels. or 1. Related standards not addressed in this paper, and specifying conduction cooled implementations for Eurocard, are VITA 48 describing VPX VITA 46 mechanical implementations and VITA 57 dealing with FMC mezzanines. 0 in. 0 in. DescriptioN sa - staNDarD commerciaL vX3920 vX3920-sa-B1a00 3U VPX 10/40 GbE Switch, full managed L2, L3, QoS, Multicast, IPv6. January 3rd, 2021. blank = mSATA available in Air Cooled configuration*, /C3 = mSATA cutouts 4399-00 (only required when CC1 cooling option selected) XMC Connector Type: t: blank = XMC (VITA 42) Connectors , /X2 = XMC2 (VITA 61) Connectors: Note * - mSATA sockets are always available unless ordering a conduction cooled (CC1) board. Acromag VPX products are designed for COTS applications. Sarsen Technology supports a range of high performance computer graphics hardware based on NVIDIA and AMD technology for applications including GPGPU computing, video capture and processing, Artificial Intelligence (AI), and data archiving. Select one of the products below to see specifications and learn more. View product Compare. The panels on both the front and rear slots are removable for ease of probing and debugging. 3U VPX carrier card. True 6-Channel design provides full OpenVPX support. Conduction cooled VPX modules require that there be no front panel IO; Improved modularity and scalability of complex architectures; Coaxial interconnects in modules can significantly improve isolation from interference and noise. The specification of 6U VPX calls for computer cooling via a conduction-cooled envelope compliant with the IEEE standard IEEE-1101. 00" pitch. 2 specification. XMC. This system. The LoC-600 is an ATR chassis designed to maintain safe operating temperatures for high power 3U VITA 48. A x8 PCI Express 2. View product. High Performance Embedded Computing. 2. Rugged, Conduction or Air cooled, 3U Dual Core 8640/41D PowerPC for VPX. A pass-through backplane is also available, enabling the application developer to cable any desired topology. 6"W x 9. Power and reset LEDs are provided for. Depending on local conditions, packaging and freight charges might not be included. Compare. Software. Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. The Condor GR5-P2000 is a 3U VPX graphics & GPGPU card that is based on the “chip-down” NVIDIA® Quadro® Pascal™ P2000 GPU (GP107). or electronic warfare capabilities, which means that AFT-cooled plug-in VPX modules – including both 3U and 6U form factors – retains the current VITA 46. A network-attached Flyable Data Loader (FDL). Built with aero-grade aluminum, the chassis are suitable for rugged onboard/mobile applications and can operate under extreme temperatures, dust and humidity. View. [email protected] Single Board Computer. Data Center Solutions. pitch air-cooled VPX (VITA 48. pitch without solder-side cover; 0. The DK3 for 3U VPX features an open frame concept and enhanced flexibility, with fast conversion between air and conduction cooled module guides. Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards. ACT developed an integrated design and delivered turnkey parts that were developed to be highly ruggedize and provided thermal conductivity > 750 W/m-K. MIL-STD-704F compliant except 50mSec holdup provided by separate module. 1-2201-compliant conduction-cooled 3UVPX carrier card . Five slots 3U VPX conduction cooled Chassis. A Tour of VITA AFT Cooling Standards in 2023 For critical and intelligent deployed embedded modules, air-flow-through (AFT) cooling describes an approach that brings the coolant much closer to heat-generating electronics than standard conduction-cooled approaches. Operating Temperature Range Storage Temperature Range; Min Max Min Max; AC1: Air Cooled Industrial-40°C +70°C-55°C +100°C: CC1: Conduction Cooled Industrial-40°C +70°C-55°C +100°C: Operating Humidity Range: Up to 95% (non-condensing) EMC: FCC 47CFR Part 2FPGA, 19 Zoll, Nvidia Jetson, CPCI, VPX air cooled, VPX conduction cooled, MicroTCA, Ip-Core, and NVME SSD Locations Primary Industriestraße 10. The D575. 8 in. 14 Slot VPX Conduction-Cooled System with Air Assist. Conduction-Cooled XMC with Dual 10 Gigabit Ethernet Interfaces and Rugged Optical Connector. N/A. Front Panel: 2x 10G SFP+. The XPand1010’s design eliminates card cages, rear transition modules, and large noisy fans. Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards; Verifi es chassis can meet power. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your development cycle. The XPand1007 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. Part of our 1400 Series of conduction cooled enclosures with air assist, the 1440 is designed to maintain safe operating temperatures for high slot count 3U VPX systems and may be used as a deployment or development chassis. The DK3 for 3U VPX features an open frame concept and enhanced flexibility, with fast conversion between air and conduction cooled module guides. 6U VPX Load Board, conduction-cooled 6U x 160mm, conduction-cooled . VPX6860: 6U AcroExpress OpenVPX SBC Air or Conduction-Cooled Description. It can support several Atrenne 3U backplanes, including variants supporting Gen-3 10 Gbaud, or a custom backplane. Fast backplane replacement makes for easy reconfiguration in support of every stage of development. Also available: 3U VPX HOST SIDE Bus Extention Adapter PCIe Gen. Serial I/O. Elma Bustronic Corp. The Behlman VPXtra® series of COTS AC to DC and DC to DC power supply are rugged, highly reliable, conduction cooled, switch mode unit built for high-end industrial and mission critical military. 1000BaseT. This enables the VX305C-40G to sustain 70°C card edge temperature according to VITA 47 XMC support. Conduction Yes 12 TB 5 GB/s Yes Host Based Yes 7x PCIe Gen3 x4/x8 If used with StoreEngine. (0°C to +55°C) and conduction-cooled version (-40°C to + 85°C). 6-Slots of 3U VPX with integral 6-channel intelligent 400W power supply. The XChange3000 is a 3U VPX-REDI module supporting a single-width XMC or PrPMC card. 4 PTC resistors (TMP300 IC); one each at the front at bottom and top as well as rear top and bottom, analog output 10mV/°C (typical 750mV ±30mV at 25°C), Optional DVM plug-on board, Voltage and temperature sense lines are connected to 2 x 8 pin header (X1 connector) on front panel, Voltage levels for. It is designed to accommodate best-in-class 3U CMOSS and SOSA aligned payloads to meet mission needs with minimal time to theater. 2-2020: Mechanical Specification for Microcomputers Using REDI Conduction Cooling Applied to VPX; This Standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two. It also supports dual Gigabit Ethernet, GPIO, I²C, XMC I/O,. It supports up to two 0. Revolutionary design allows for up to 175. 3U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. Keying for Conduction Cooled VME64x: This standard is an extension of the VME64x Standard, ANSI/VITA 1. An AFT heat frame includes a closed duct, which is embedded with fins. Usually the test adapter includes fields for voltage and amp, current measurements and in some cases also some pins for wire wrap to conduct custom. Two-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O. It delivers cooling performance comparable to conduction-cooled systems, yet is easier to implement and weighs much less than a comparable. LCR’s 19” 3U VPX Development Chassis for small to large scale projects is a rackmount or desktop solution for VPX and SOSA aligned payloads. The XChange3030 provides six backplane 40GBASE-KR4 Ethernet ports, six backplane. 2 chassis, heat is conducted away from hot module components through the heat sink and out to the module wedge locks. "With its optimized cooling path and quick turn customization of the. 2 -40°C to 85°C (Rugged Conduction Cooled)Dawn’s VPX Development System for 3U OpenVPX boards aligns well with the requirements specified within Draft 1. This system supports standard SBC and switch modules, as well as VITA 67 modules, making it the ideal platform for high-performance RF applications. Products. 0 in. MIL-STD-704F compliant except 50mSec holdup provided by separate module. 2 (REDI) )0 inch pitch conduction cooled payload slots in Long format (# of slots in Short format TBD) Configurable rigid front I/O PCBA and 7. The XPedite8101 is an Intel® Atom™ E3800-based XMC/PMC available in conduction- and air-cooled configurations. . 0, with conduction-cooled and air-cooled versions, provide the assurance of mechanical ruggedization in COTS-based military systems. The 3U VPX form factor is compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65. It is designed to work as the system controller in command, control, communicate and compute applications and has a wide range of interface and storage options. Fast backplane replacement makes. The XChange3000 is a 3U VPX-REDI module supporting a single-width XMC or PrPMC card. View product. Secondary Side Wedge lock conduction cooled. Read the full article hereHartmann’s VPX Power Supplies are built for the most rugged applications with quality and reliability in mind. 0 in. SolidWedge™. VITA 62 Compliant 3U VPX power supply. As part of our AoC, air over conduction cooled ATR line, the 810 is designed to maintain safe operating temperatures for high power 3U VPX and SOSA. pitch without solder-side cover (optional) 1. 2 conduction-cooled modules due to an established deployment track record. The PMC-1553 is the Only Commercial Off the Shelf (COTS) Card that Passes and Executes the SAE AS4111/4112. It provides guidelines for constructing the frame, which is an essential part of the conduction-cooled module’s thermal. The VTX985 is a dual slot 3U VPX chassis conduction cooled for two 3U VPX modules. 2 conduction cooled 6U VPX module with 1 inch pitch : • 6Ux160mm form factor as defined by IEEE 1101. pitch conduction-cooled VPX (VITA 48. The result is a powerful and flexible I/O processor module that is capable of executing custom instruction sets and algorithms. The XPedite6101 supports multiple processor configurations, a number of I/O options, and up. Chassis Example: WILD40 Forced-Air, Conduction-Cooled 3U OpenVPX Chassis has an operating temperature of –40˚C to +70˚C. Standard Air- and Rugged Conduction-Cooled Versions; Download Datasheet Request information Add to compare. Accessories. This fully-defined, backplane-centric VPX module optionally supports either commercial GNSS receivers (i. 2) modules. 1 compliant cPCI, 2 through 8 slots, 32 bit or 64 bit configurations, +5VIO or +3. -40 - 85°C (Conduction Cooled) Capture only. ANSI/VITA 48. 00730 VITA 62 and MIL-STD compliant 3U DC-DC supply provides up to 360W output power while operating with highest efficiency. Intel Xeon Quad Core Xeon E3-1505M V5 (47W) Intel C230 series CM236 PCH chipset; Up to -40 to 85°C extended operating range; Programmable CPU power for heat sensitive apps. 3U VPX, 6U VPX, and OpenVPX-based SBCs, I/O, storage, switches, rugged systems, and development platforms featuring Intel Core i7, Intel Xeon D, & Freescale QorIQ T-Series and P-Series processor technology. Intel® Xeon® D-1700 Processor-Based Rugged. Signal rate: 3. ENHANCE THE PERFORMANCE & RELIABILITY OF YOUR SYSTEM WITH ONE DESIGN DECISION. Ordering Information: Dawn P/N 11-1017632-01. Reconfigurable. 115 Watts Primary or Secondary Side wedgelocks. or 1. pitch;. XChange3012 3U VPX Switch | PCI Express | Gigabit Ethernet Integrated | XMC Support. Today ATR’s are introduced into applications imagined never before, including surveillance, data collection, storage and weapons control. 2 mechanical format. The module utilizes Vicor proprietary technology to enable high efficiency and power density for this highly rugged, conduction-cooled model. 85°C (derating above 60°C) Size: 3U, 0. - Dawn VME Products, a leading designer and manufacturer of high performance and reliable embedded packaging technology. or 1. VITA 48. 2, which is compatible with existing enclosures. August 2021 – Norristown, PA – LCR Embedded Systems has released two new conduction cooled chassis for high speed VPX systems. VITA 46. A onboard DC/DC converter. The XPedite8171 is an Intel® Atom™ E3800-based 3U VPX-REDI single board computer available in conduction- and air-cooled configurations. Request Information close. The 53xxx Series mounts one XMC module on a 3U VPX carrier with a flexible crossbar switch. VITA 67. 6-slot, 3U OpenVPX (VITA 65) backplane, 1-in pitch. It features a FMC+ slot. 3V auxiliary Parallel operation capable with proprietary wireless. Advanced airflow design distributes air across external fins in sidewalls. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. This Model Can be used to design the VITA Card Chassis. Extended temperature options. pitch conduction-cooled VPX (VITA 48. RuSH controlled power and cooling supports high current demands and corresponding high cooling. Graphics Processing Units (GPUs) LCR Embedded Systems’ fully integrated, conduction-cooled, featherweight 2-Slot VPX System (shown at right) will break new ground in addressing the concerns of UAV application developers and allow for the massive expansion of payload performance and processing power for autonomous vehicles. -No. Conduction-Cooled Option. One Payload and remaining Peripheral Slots (with Switch slot option) High Speed fans with 1U Tray at the bottom. 1, titled “VPX Conduction Cooling: Frame Construction,” extends the VITA 48. Works With: Subracks; Cases. The ICE-Lok® thermally enhanced Wedge. VPX 6U Load Board Conduction Cooled. A XMC module can therefore have two PCIexpress chips on board without using an additional switch on the XMC board. conduction or air-cooled modules. Also Available: A rugged ATR versionFeatures. 0) is a widely adopted VPX-based standard which builds on the great success VME systems have had in this arena. FPGA Family. With a Core 2 Duo processor at up to 2. It is designed to maintain power to critical systems during short interruptions or voltage fluctuations in the main power source. 300-400 Watts Pluggable VPX PSU. See full list on xes-inc. Max 10. VPX plug-in LFT modules use liquid flowing through an integral heatsink of the module for cooling the circuit board. 2-2020: Mechanical Specification for Microcomputers Using REDI Conduction Cooling Applied to VPX. Elma’s latest 6U VPX load board comes in a conduction-cooled format as per the IEEE standard 1101. The new cooling standard defines design requirements for platforms that need high performance processing, graphics. It helps test a system's coolingcapabilities. pitch conduction-cooled VPX (VITA 48. 0, 2. The design incorporates a Blu-Ray drive, SBC, Power Supply and ECS (Environmental Control System). slots support conduction-cooled 3U VPX, 3U cPCI, or power supply modules. We offer air & conduction cooled power supply units for wide range AC as well as DC input. These rugged power supplies are available in 200W-1300W power configurations. View product. Cooling air flows directly over the board.